India will require 2.5 to 3 lakh skilled professionals by 2027 in the R&D, design, manufacturing, and advanced packaging domains as the nation begins its ambitious semiconductor journey, according to a report.
According to the report produced by TeamLease Degree Apprenticeship, India's talent pool, targeted government initiatives, de-risking efforts by the world's leading electronic manufacturers, and its position as a global leader in semiconductor manufacturing have all contributed to the nation's success. Anticipated to turn into a $100 billion industry by 2030, the development is ready to produce roughly 1 million worldwide positions by 2025-2026, lining up with India's more extensive monetary and modern development goals.
The Electronics Sector Skill Council (ESSC) presently delivers more than 35 apprenticeship courses under the National Apprenticeship Promotion Scheme (NAPS) plan to address expertise deficiencies at different degrees of entry-level work. The TeamLease Degree Apprenticeship is actively collaborating with academic institutions, government agencies, and industry leaders to fill this gap. TeamLease Degree Apprenticeship CEO Ramesh Alluri Reddy emphasized the necessity of increasing employment in India, particularly in light of the $15 billion investment in three semiconductor plants. The Production Linked Incentive (PLI) program and the India Semiconductor Mission (ISM) led to this investment.
“Advancements in AI-driven technologies are pushing India towards higher-value activities in the semiconductor industry. AI-powered chip design and smart manufacturing are creating a demand for professionals skilled in artificial intelligence (AI), Internet of Things (IoT) and 5G,” said Reddy.
